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TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier with differential inputs and diagnostic outputs
Rev. 06 -- 15 October 2007 Product data sheet
1. General description
The TDA8566 is an integrated class-B output amplifier which is available in several packages. TDA8566TH is contained in a 20-lead small outline plastic package. The TDA8566TH1 is a 24-lead small outline plastic package which is pin compatible with the I2C-bus controlled amplifier TDA1566TH for one board layout. TDA8566Q is a 17-pin DIL-bent-SIL package. The device contains 2 amplifiers in a Bridge-Tied Load (BTL) configuration. The output power is 2 x 25 W in a 4 load or 2 x 40 W in a 2 load. It has a differential input stage and 2 diagnostic outputs. The device is primarily developed for car radio applications.
2. Features
I I I I I I I I I I I I I I I I I I I I Differential inputs Very high Common Mode Rejection Ratio (CMRR) High common mode input signal handling Requires very few external components High output power 4 and 2 load driving capability Low offset voltage at output Fixed gain Diagnostic facility (distortion, short-circuit and temperature pre-warning) Good ripple rejection Mode select switch (operating, mute and standby) Load dump protection Short-circuit proof to ground, to VP and across the load Low power dissipation in any short-circuit condition Thermally protected Reverse polarity safe Protected against electrostatic discharge No switch-on/switch-off plops Low thermal resistance TDA8566TH1 is pin compatible with TDA1566TH
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
3. Quick reference data
Table 1. Quick reference data VP = 14.4 V; Tamb = 25 C; fi = 1 kHz; measured in test circuit of Figure 9; unless otherwise specified. Symbol Parameter VP IORM Iq Istb Zi Po SVRR cs CMRR Gv Vn(o)
[1] [2] [3] [4]
Conditions
[1]
Min 6 -
Typ 14.4 115 0.1 120 25 40 60 50 75 26 85
Max 18 7.5 180 10 150 27 120
Unit V A mA A k W W dB dB dB dB V
supply voltage repetitive peak output current quiescent current standby current input impedance output power supply voltage ripple rejection channel separation differential RL = 4 ; THD = 10 % RL = 2 ; THD = 10 % operating Po = 25 W; Rs = 10 k RL =
100 21 33
[2]
50 45
common mode rejection Rs = 0 ratio closed loop voltage gain noise output voltage operating; Rs = 0
[3]
60 25
[4]
-
The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 . Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 . Noise measured in a bandwidth of 20 Hz to 20 kHz.
4. Ordering information
Table 2. Ordering information Package Name TDA8566TH TDA8566TH1 TDA8566Q HSOP20 HSOP24 DBS17P Description plastic, heatsink small outline package; 20 leads; low stand-off height plastic, heatsink small outline package; 24 leads; low stand-off height plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) Version SOT418-3 SOT566-3 SOT243-1 Type number
TDA8566_6
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
2 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
5. Block diagram
VP1 IN1+ mute switch VP2
CM
IN1- VA
2.3 k 2.3 k
OUT1+
mute switch
(9x) CM
VA
60 k 60 k 2.3 k 2.3 k (9x)
OUT1-
n.c. standby switch VA standby reference voltage MODE
TDA8566
mute switch
Vref SGND 1x
CLIP
CLIP
DIAG mute reference voltage mute switch
CM
DIAG
60 k
60 k
IN2+
IN2- VA
2.3 k 2.3 k
OUT2+
mute switch
(9x) CM
VA
2.3 k
OUT2-
HEATTAB(1)
2.3 k (9x)
PGND2
PGND1
mgu358
(1) Pin HEATTAB is available in TDA8566TH1 only.
Fig 1. Block diagram
TDA8566_6
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Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
6. Pinning information
6.1 Pinning
HEATTAB 24 MODE 20 VP2 19 OUT2- 18 PGND2 17 OUT2+ 16 OUT1- 15 PGND1 14 OUT1+ 13 VP1 12 CLIP 11
001aag902 001aah015
1 2 3 4 5
DIAG IN2+ IN2- n.c. n.c. n.c. MODE n.c. n.c.
1 2 3 4
DIAG IN2+ IN2- n.c. n.c. n.c. n.c. IN1+ IN1-
VP2 23 n.c. 22 OUT2- 21 PGND2 20 OUT2+ 19 OUT1- 18 PGND1 17 OUT1+ 16 n.c. 15 VP1 14 CLIP 13
TDA8566TH
5 6 7 8 9
TDA8566TH1
6 7 8 9
10 IN1+ 11 IN1- 12 SGND
10 SGND
Fig 2. Pin configuration TDA8566TH
Fig 3. Pin configuration TDA8566TH1
IN1+ IN1- SGND CLIP VP1 OUT1+ PGND1 OUT1- n.c.
1 2 3 4 5 6 7 8 9
TDA8566Q
OUT2+ 10 PGND2 11 OUT2- 12 VP2 13 MODE 14 DIAG 15 IN2+ 16 IN2- 17
001aah059
Fig 4. Pin configuration TDA8566Q
TDA8566_6
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Product data sheet
Rev. 06 -- 15 October 2007
4 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
6.2 Pin description
Table 3. Symbol DIAG IN2+ IN2- n.c. n.c. n.c. n.c. n.c. n.c. IN1+ IN1- SGND CLIP VP1 n.c. OUT1+ PGND1 OUT1- n.c. OUT2+ PGND2 OUT2- n.c. VP2 MODE HEATTAB Table 4. Symbol IN1+ IN1- SGND CLIP VP1 OUT1+ PGND1 OUT1- n.c.
TDA8566_6
Pin description TDA8566TH and TDA8566TH1 Pin TDA8566TH 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 TDA8566TH1 1 2 3 4 5 6 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 7 24 short-circuit and temperature pre-warning diagnostic output channel 2 input positive channel 2 input negative not connected not connected not connected not connected not connected not connected channel 1 input positive channel 1 input negative signal ground clip detection output supply voltage 1 not connected channel 1 output positive power ground 1 channel 1 output negative not connected channel 2 output positive power ground 2 channel 2 output negative not connected supply voltage 2 mode select switch input (standby/mute/operating) connect to ground, used for test purposes only Description
Pin description TDA8566Q Pin 1 2 3 4 5 6 7 8 9 Description channel 1 input positive channel 1 input negative signal ground clip detection output supply voltage 1 channel 1 output positive power ground 1 channel 1 output negative not connected
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
5 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
Pin description TDA8566Q ...continued Pin 10 11 12 13 14 15 16 17 Description channel 2 output positive power ground 2 channel 2 output negative supply voltage 2 mode select switch input (standby/mute/operating) short-circuit and temperature pre-warning diagnostic output channel 2 input positive channel 2 input negative
Table 4. Symbol OUT2+ PGND2 OUT2- VP2 MODE DIAG IN2+ IN2-
7. Functional description
The TDA8566 contains 2 identical amplifiers and can be used for BTL applications. The gain of each amplifier is fixed at 26 dB. Special features of this device are:
* * * * * *
Mode select switch Clip detection Short-circuit diagnostic Temperature pre-warning Open-collector diagnostic outputs Differential inputs
7.1 Mode select switch (pin MODE) * Standby: low supply current * Mute: input signal suppressed * Operating: normal on condition
Since this pin has a very low input current (< 40 A), a low-cost supply switch can be applied. To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode for a period of 150 ms (charging the input capacitors at pins IN1+, IN1-, IN2+ and IN2-). This can be realized by using a microcontroller or by using an external timing circuit as illustrated in Figure 8.
7.2 Clip detection (pin CLIP)
When clipping occurs at one or more output stages, the dynamic distortion detector becomes active and pin CLIP goes LOW. This information can be used to drive a sound processor or a DC volume control to attenuate the input signal and so limit the level of distortion. The output level of pin CLIP is independent of the number of channels that are being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection waveforms are illustrated in Figure 5.
TDA8566_6
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
6 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
VO (V) 0
VCLIP (V) 0
t (s)
mgu357
Fig 5. Clip detection waveforms
7.3 Short-circuit diagnostic (pin DIAG)
When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are switched off until the short-circuit is removed and the device is switched on again (with a delay of approximately 20 ms after the removal of the short-circuit). During this short-circuit condition, pin DIAG is continuously LOW. When a short-circuit occurs across the load of one or both channels, the output stages are switched off for approximately 20 ms. After that time the load condition is checked during approximately 50 s to see whether the short-circuit is still present. Due to this duty cycle of 50 s/20 ms the average current consumption during the short-circuit condition is very low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH for 50 s; see Figure 6. The power dissipation in any short-circuit condition is very low.
current in output stage
short-circuit over the load VDIAG (V) 20 ms
t (s)
t (s) 50 s
mgu360
Fig 6. Short-circuit diagnostic timing diagram
7.4 Temperature pre-warning (pin DIAG)
When the virtual junction temperature (Tvj) reaches 145 C, pin DIAG will become continuously LOW.
7.5 Open-collector diagnostic outputs
Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is required.
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Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
7.6 Differential inputs
The input stage is a high-impedance fully differential balanced input stage that is also capable of operating in a single-ended mode with one of the inputs capacitively coupled to an audio ground. It should be noted that if a source resistance is added (input voltage dividers) the CMRR degrades to lower values.
8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VP Parameter supply voltage Conditions operating non-operating load dump protection; during 50 ms; tr 2.5 ms IOSM IORM Tstg Tvj Tamb Vpsc Vrp Ptot non-repetitive peak output current repetitive peak output current storage temperature virtual junction temperature ambient temperature short-circuit safe voltage reverse polarity voltage total power dissipation Min -55 -40 Max 18 30 45 10 7.5 +150 150 +85 18 6.0 60 Unit V V V A A C C C V V W
9. Thermal characteristics
Table 6. Thermal characteristics Thermal characteristics in accordance with IEC 60747-1. Symbol Rth(j-c) Rth(j-a) Parameter thermal resistance from junction to case Conditions see Figure 7 Typ 1.3 40 Unit K/W K/W
thermal resistance from junction to ambient in free air
output 1 virtual junction 2.2 K/W
output 2
2.2 K/W
0.2 K/W case
001aaa155
Fig 7. Equivalent thermal resistance network
TDA8566_6
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
8 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
10. Static characteristics
Table 7. Static characteristics VP = 14.4 V; Tamb = 25 C; measured in test circuit of Figure 9; unless otherwise specified. Symbol Supply VP Iq VMODE IMODE VO VOO VMODE VO VOO VOO supply voltage quiescent current mode select switch level mode select switch current output voltage output offset voltage mode select switch level output voltage output offset voltage output offset voltage difference mode select switch level standby current diagnostic output voltage during any fault condition with respect to operating condition
[2] [1]
Parameter
Conditions
Min 6 8.5
Typ 14.4 115 15 7.0 7.0 -
Max 18 180 VP 40 100 6.4 60 60
Unit V mA V A V mV V V mV mV
RL =
Operating condition
VMODE = 14.4 V
[2]
3.3 -
Mute condition
Standby condition VMODE Istb VDIAG
[1] [2]
0 -
0.1 -
2 10 0.6
V A V
Diagnostic
The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V. At VP = 18 V to 30 V the DC output voltage is 0.5VP.
TDA8566_6
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
11. Dynamic characteristics
Table 8. Dynamic characteristics VP = 14.4 V; Tamb = 25 C; RL = 2 ; fi = 1 kHz; measured in test circuit of Figure 9; unless otherwise specified. Symbol Po Parameter output power Conditions THD = 0.5 % THD = 10 % THD = 30 % VP = 13.5 V; THD = 0.5 % VP = 13.5 V; THD = 10 % THD = 0.5 %; RL = 4 THD = 10 %; RL = 4 THD = 30 %; RL = 4 VP = 13.5 V; THD = 0.5 %; RL = 4 VP = 13.5 V; THD = 10 %; RL = 4 THD total harmonic distortion Po = 1 W VCLIP = 0.6 V Po = 1 W; RL = 4 B fro(l) fro(h) Gv SVRR power bandwidth low frequency roll off high frequency roll off closed loop voltage gain supply voltage ripple rejection operating mute standby Zi |Zi| Vn(o) input impedance input impedance mismatch noise output voltage operating; Rs = 0 operating; Rs = 10 k mute; independent of Rs cs |Gv| channel separation channel unbalance Po = 25 W; Rs = 10 k
[4] [4] [4] [3] [3] [3] [1]
Min 25 33 45 16 21 28 [2]
Typ 30 40 55 25 35 19 25 35 14 22 0.1 8 0.05 20 to 20000 25 26 60 120 60 2 85 100 60 50 -
Max 27 150 75 120 1
Unit W W W W W W W W W W % % % Hz Hz kHz dB dB dB dB k k % V V V dB dB
THD = 0.5 %; Po = -1 dB with respect to 25 W -1 dB -1 dB
20 25 50 50 80 100 50 45 -
differential single-ended
TDA8566_6
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Product data sheet
Rev. 06 -- 15 October 2007
10 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
Table 8. Dynamic characteristics ...continued VP = 14.4 V; Tamb = 25 C; RL = 2 ; fi = 1 kHz; measured in test circuit of Figure 9; unless otherwise specified. Symbol Vo(mute) CMRR Parameter output signal voltage in mute common mode rejection ratio Conditions Vin = Vin(max) = 1 V (RMS) Rs = 0 Rs = 45 k
[5] [6]
Min 60 40
Typ 75 -
Max 2 -
Unit mV dB dB
[1] [2] [3] [4] [5] [6]
Dynamic distortion detector active; pin CLIP is LOW. Frequency response externally fixed. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 . Noise measured in a bandwidth of 20 Hz to 20 kHz. Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 . Common mode rejection ratio measured at the output (over RL) with both inputs tied together; Vcommon 3.5 V (RMS); fi = 1 kHz; Rs = 45 k. The mismatch of the input coupling capacitors is excluded.
12. Application information
12.1 Diagnostic output
Special care must be taken in the PCB layout to separate pin CLIP from pins IN1+, IN1-, IN2+ and IN2- to minimize the crosstalk between the CLIP output and the inputs.
12.2 Mode select switch
To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode during 150 ms (charging of the input capacitors at pins IN1+, IN1-, IN2+ and IN2-). The circuit in Figure 8 slowly ramps-up the voltage at the mode select switch pin when switching on and results in fast muting when switching off.
+VP
S
10 k
100
+
47 F
mode select switch
100 k
mgd102
Fig 8. Mode select switch circuit
TDA8566_6
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
13. Test information
+ VMODE
_ MODE
Rs/2 220 nF
VP1
VP2
100 nF
2200 F (16V)
+
VP = _ 14.4 V
IN1+ OUT1+
60 k
Vin1
60 k
TDA8566
220 nF
RL1
OUT1-
VP
10 k
VP
10 k
Rs/2
IN1-
CLIP DETECTOR
Vref SGND
Rs/2 220 nF
CLIP
-
DIAGNOSTIC INTERFACE
DIAG
IN2+ OUT2+
60 k
Vin2
220 nF 60 k
RL2
OUT2-
Rs/2
IN2-
PGND1
PGND2
mgu359
Fig 9. Stereo BTL test diagram
TDA8566_6
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
12 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
14. Package outline
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 20 Z e bp 11 wM (A3) A 10
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.5 2.0 8 0
+0.08 0.53 0.32 16.0 13.0 -0.04 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT418-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 02-02-12 03-07-23
Fig 10. Package outline SOT418-3 (HSOP20)
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Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-3
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 24 Z e bp 13 wM (A3) A 12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.7 2.2 8 0
+0.08 0.53 0.32 16.0 13.0 -0.04 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT566-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 03-02-18 03-07-23
Fig 11. Package outline SOT566-3 (HSOP24)
TDA8566_6 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave D x Dh
Eh
view B: mounting base side A2
d
B j E A
L3
L
Q c vM
1 Z e e1 wM
17 m e2
bp
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e e1 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
2.54 1.27
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-17 03-03-12
Fig 12. Package outline SOT243-1 (DBS17P)
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Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
15. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
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Product data sheet
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
15.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10
Table 9. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 10. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 13.
TDA8566_6
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Product data sheet
Rev. 06 -- 15 October 2007
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NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
TDA8566_6
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Product data sheet
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2 x 40 W/2 stereo BTL car radio power amplifier
16. Revision history
Table 11. Revision history Release date 20071015 Data sheet status Product data sheet Change notice Supersedes TDA8566Q_5 TDA8566TH_2 Document ID TDA8566_6 Modifications:
* * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 9 "Thermal characteristics": changed value of Rth(j-c) to 1.3 K/W Figure 7: values updated Included TDA8566TH1 and TDA8566Q in the data sheet Product specification Product specification -
TDA8566Q_5 TDA8566TH_2
20010221 20030708
TDA8566_6
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Product data sheet
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2 x 40 W/2 stereo BTL car radio power amplifier
17. Legal information
17.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
17.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
TDA8566_6
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 -- 15 October 2007
20 of 21
NXP Semiconductors
TDA8566
2 x 40 W/2 stereo BTL car radio power amplifier
19. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 12.1 12.2 13 14 15 15.1 15.2 15.3 15.4 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Mode select switch (pin MODE) . . . . . . . . . . . . 6 Clip detection (pin CLIP). . . . . . . . . . . . . . . . . . 6 Short-circuit diagnostic (pin DIAG) . . . . . . . . . . 7 Temperature pre-warning (pin DIAG) . . . . . . . . 7 Open-collector diagnostic outputs . . . . . . . . . . 7 Differential inputs . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 11 Diagnostic output . . . . . . . . . . . . . . . . . . . . . . 11 Mode select switch . . . . . . . . . . . . . . . . . . . . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering . . . . . . . . . . . . . . . . . 16 Wave and reflow soldering . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 October 2007 Document identifier: TDA8566_6

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